April 17, 2007
Intel Expands Multi-core Programme
to 37
Chinese Varsities By Fakir Balaji
Beijing
In a bid to groom the next generation of chip designers and embedded
software developers, Intel Corporation Tuesday announced expanding
its multi-core programme to 37 universities across China.
The university programme provides students training in multi-core
technology for a career as a developer in the global IT industry.
Announcing the course at the Intel Development Forum (IDF) here,
Intel China president Wee Theng Tan said the $35-billion chipmaker
was committed to advancing innovation and cultivating talent in the
country.
"Going forward, we will extend the partnership to 32 more
universities for designing multi-core curriculum, research and
training programmes. The joint multi-core labs, being set up in all
the 37 universities, will help integrate multi-core technology in
teaching and research to create talent adaptive to the digital era,"
Wee told delegates at the forum at the Beijing international
convention centre.
The programme will also support China's higher education quality
project and help accelerate integration of advanced technology into
the emerging software segment in the IT industry.
"To attract talent and popularise the educational scheme, we have
unveiled a national multi-core programming contest with a top prize
of RMB 50,000 ($6500). We intend to promote multi-core based
software programming capabilities among undergraduate students and
technology buffs," Wee said.
Over the next 12 months, the company also plans to spread the
multi-core curriculum programmes to about 200 universities across
Asia and 400 varsities worldwide.
In the last two decades since Intel forayed into China, the company
has been associating with education programmes from K-12 (higher
secondary), with focus on tech workshops to teacher trainings.
Intel forum kicks off with
slew of product launches
Intel Corporation, the world's biggest chipmaker, Tuesday launched
20 new products, including some featuring 45 nanometre (nm) chips,
at its development forum meet here.
The two-day mega event, with about 4,000 delegates from the world
over, is being held for the first time outside the US to drive
innovations and foster collaborations through vision, training and
networking opportunities.
To outsmart its chip rival, advanced micro devices (AMD), in
deploying the new processor in place of the present standard (65
nm), the $35 billion US firm claimed its 45 nm chips offered high
cost savings and performance advantages.
Outlining the performance and efficiency improvements of the 45 nm
chips, code-named Penryn, Intel digital enterprise group head
Patrick Gelsinger said desktop PCs will be 25 percent faster at 3D
(three dimension) rendering and 40 percent faster for gaming and
video encoding.
The 45 nm manufacturing process will enable Intel to double the
transistor density of a chip from the 65 nm technology. The new
process will roll out chips that consume less power and generate
less heat.
Though AMD is also in the race to develop the 45 nm transistor line
for use in its next-generation processors that integrate x86 and
graphic cores on a single chip, Intel plans to start shipping the
first of its 45 nm Penryn server processors in the second quarter of
this year.
The 45 nm circuitry will have four processors on a single chip as
against the quad-core processor, which integrates duo-core chips.
"We are also planning products based on an architecture code-named
project Larrabee to enable super-computer-like teraflop
performance," Gelsinger told the delegates in his keynote address
during the inaugural session.
The Larrabee project, being co-developed by Intel's Indian R&D team
at its Bangalore facility with its counterparts in the US, is
designed to process trillions of data operations per second
(teraflops) and accelerate applications such as scientific
computing, recognition mining, synthesis, visualisation, financial
analytics and health applications.
Providing an overview of the products and the initiatives being
undertaken, Gelsinger said Penryn performance tests also showed a 15
percent increase in imaging applications. The tests were based on
pre-production of its 45 nm quad core processing, which runs at 3.33
Ghz with a 1333 front side bus and 12 mb cache versus.
Intel digital home group head Eric Kim said the company would soon
enable computers to start up faster and speed the opening of
applications.
"Similarly, our media share software will allow consumers to stream
media files from PCs to laptops over a wireless home network. It
will also offer home manageability features, where systems can be
managed, repaired and updated remotely," Kim pointed out.
Intel is also planning to deliver a system on a chip (SoC) next year
for a new generation of Internet-compatible electronics devices,
such as digital set-top boxes.
The first of the products for business and high-performance
computing, codenamed Tolapai, will have a footprint that is 45
percent less than a standard four-chip design, and use 20 percent
less power. It will also have better performance and processor
efficiency.
Incidentally, the annual event that used to be held at San Francisco
in the past has been shifted to Beijing this year, signalling the
strategic importance of China and other emerging markets in Asia
such as India for Intel's growth.
Last month, Intel announced the setting up of its first Asian 300 mm
wafer fabrication plant at Dalian in the northeast part of the
mainland at an estimated cost of $2.5 billion and employing about
1,500 people in the first phase.
Boloji.com is owned and managed by Boloji Media Inc Privacy Policy |
Disclaimer
No part of this Internet site may
be reproduced without prior written permission of the copyright holder.
